{"data":{"id":"us/15-cfr-231.117","jurisdiction":"us","citation":"15 CFR 231.117","heading":"Semiconductor manufacturing capacity.","body":"Semiconductor manufacturing capacity means the productive capacity of a facility for semiconductor manufacturing. In the case of a wafer production facility, semiconductor manufacturing capacity is measured in wafers per year. In the case of a semiconductor fabrication facility, semiconductor manufacturing capacity is measured in wafer starts per year. In the case of a semiconductor fabrication facility for wafers designed for wafer-to-wafer bonding structure, semiconductor manufacturing capacity is measured in stacked wafers per year. In the case of a packaging facility, semiconductor manufacturing capacity is measured in packages per year.","path":["Title 15—Commerce and Foreign Trade","Subtitle B—Regulations Relating to Commerce and Foreign Trade","CHAPTER II—NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, DEPARTMENT OF COMMERCE","SUBCHAPTER C—CHIPS PROGRAM","PART 231—CLAWBACKS OF CHIPS FUNDING","Subpart A—Definitions"],"source_url":"https://www.ecfr.gov/api/versioner/v1/full/2026-08-25/title-15.xml","current_through":"2026-08-25","vintage":"","retrieved_at":"2026-08-27T02:24:24Z","sha256":"6b76fc45205db806094e83fd2be7efd58396381425d279501fef63424e162c02","source_id":"us-cfr","stale":true,"prev":"us/15-cfr-231.116","next":"us/15-cfr-231.118"},"notice":"GroundRules: Original legal text. Not legal advice."}