{"data":{"id":"us/31-cfr-850.201","jurisdiction":"us","citation":"31 CFR 850.201","heading":"Advanced packaging.","body":"The term advanced packaging means to package integrated circuits in a manner that supports the two-and-one-half-dimensional (2.5D) or three-dimensional (3D) assembly of integrated circuits, such as by directly attaching one or more die or wafer using through-silicon vias, die or wafer bonding, heterogeneous integration, or other advanced methods and materials.","path":["Title 31—Money and Finance: Treasury","Subtitle B—Regulations Relating to Money and Finance","CHAPTER VIII—OFFICE OF INVESTMENT SECURITY, DEPARTMENT OF THE TREASURY","PART 850—PROVISIONS PERTAINING TO U.S. INVESTMENTS IN CERTAIN NATIONAL SECURITY TECHNOLOGIES AND PRODUCTS IN COUNTRIES OF CONCERN","Subpart B—Definitions"],"source_url":"https://www.ecfr.gov/api/versioner/v1/full/2026-08-25/title-31.xml","current_through":"2026-08-25","vintage":"","retrieved_at":"2026-08-27T02:25:25Z","sha256":"1ec70cfaaa8400eb28f30bc44d070e712e9c20dc064da3fb0a4f9fb2da4c8f97","source_id":"us-cfr","stale":true,"prev":"us/31-cfr-850.104","next":"us/31-cfr-850.202"},"notice":"GroundRules: Original legal text. Not legal advice."}