{"data":{"id":"us/40-cfr-table-i-3-to-subpart-i-of-part-98","jurisdiction":"us","citation":"40 CFR Table I-3 to Subpart I of Part 98","heading":"Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes","body":"Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes\nProcess type/sub-type Process gas i\nCF4 C2 F6 CHF3 CH2 F2 C2 HF5 CH3 F C3 F8 C4 F8 NF3 SF6 C4 F6 C5 F8 C4 F8 O\nEtching/Wafer Cleaning\n1-Ui 0.73 0.72 0.51 0.13 0.064 0.70 NA 0.14 0.19 0.55 0.083 0.072 NA\nBCF4 NA 0.10 0.085 0.079 0.077 NA NA 0.11 0.0040 0.13 0.095 NA NA\nBC2 F6 0.041 NA 0.035 0.025 0.024 0.0034 NA 0.037 0.025 0.11 0.073 0.014 NA\nBC4 F8 NA NA NA NA NA NA NA NA NA NA NA NA NA\nBC3 F8 NA NA NA NA NA NA NA NA NA NA NA NA NA\nBCHF3 0.091 0.047 NA 0.049 NA NA NA 0.040 NA 0.0012 0.066 0.0039 NA\nChamber Cleaning\nIn situ plasma cleaning\n1-Ui 0.92 0.55 NA NA NA NA 0.40 0.10 0.18 NA NA NA 0.14\nBCF4 NA 0.19 NA NA NA NA 0.20 0.11 0.14 NA NA NA 0.13\nBC2 F6 NA NA NA NA NA NA NA NA NA NA NA NA 0.045\nBC3 F8 NA NA NA NA NA NA NA NA NA NA NA NA NA\nRemote plasma cleaning\n1-Ui NA NA NA NA NA NA NA NA 0.028 NA NA NA NA\nBCF4 NA NA NA NA NA NA NA NA 0.015 NA NA NA NA\nBC2 F6 NA NA NA NA NA NA NA NA NA NA NA NA NA\nBC3 F8 NA NA NA NA NA NA NA NA NA NA NA NA NA\nBF2 NA NA NA NA NA NA NA NA 0.5 NA NA NA NA\nIn situ thermal cleaning\n1-Ui NA NA NA NA NA NA NA NA NA NA NA NA NA\nBCF4 NA NA NA NA NA NA NA NA NA NA NA NA NA\nBC2 F6 NA NA NA NA NA NA NA NA NA NA NA NA NA\nBC3 F8 NA NA NA NA NA NA NA NA NA NA NA NA NA\nNotes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.","path":["Title 40—Protection of Environment","CHAPTER I—ENVIRONMENTAL PROTECTION AGENCY","SUBCHAPTER C—AIR PROGRAMS","PART 98—MANDATORY GREENHOUSE GAS REPORTING","Subpart I—Electronics Manufacturing"],"source_url":"https://www.ecfr.gov/api/versioner/v1/full/2026-08-25/title-40.xml","current_through":"2026-08-25","vintage":"","retrieved_at":"2026-08-27T02:26:04Z","sha256":"a395f62f5496eccffae9f6605bbac816936d325379beb5a38f266f1032c3962d","source_id":"us-cfr","stale":true,"prev":"us/40-cfr-table-i-2-to-subpart-i-of-part-98","next":"us/40-cfr-table-i-4-to-subpart-i-of-part-98"},"notice":"GroundRules: Original legal text. Not legal advice."}