{"data":{"id":"us/40-cfr-table-i-4-to-subpart-i-of-part-98","jurisdiction":"us","citation":"40 CFR Table I-4 to Subpart I of Part 98","heading":"Table I-4 to Subpart I of Part 98— Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size","body":"Table I-4 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size\nProcess type/sub-type Process gas i\nCF4 C2 F6 CHF3 CH2 F2 CH3 F C3 F8 C4 F8 NF3 SF6 C4 F6 C5 F8 C4 F8 O\nEtching/Wafer Cleaning\n1-Ui 0.65 0.80 0.37 0.20 0.30 0.30 0.18 0.16 0.30 0.15 0.10 NA\nBCF4 NA 0.21 0.076 0.060 0.0291 0.21 0.045 0.044 0.033 0.059 0.11 NA\nBC2 F6 0.058 NA 0.058 0.043 0.009 0.018 0.027 0.045 0.041 0.062 0.083 NA\nBC4 F8 0.0046 NA 0.0027 0.054 0.0070 NA NA NA NA 0.0051 NA NA\nBC3 F8 NA NA NA NA NA NA NA NA NA NA 0.00012 NA\nBCHF3 0.012 NA NA 0.057 0.016 0.012 0.028 0.023 0.0039 0.017 0.0069 NA\nBCH2 F2 0.005 NA 0.0024 NA 0.0033 NA 0.0021 0.00074 0.000020 0.000030 NA NA\nBCH3 F 0.0061 NA 0.027 0.0036 NA 0.00073 0.0063 0.0080 0.0082 0.00065 NA NA\nChamber Cleaning\nIn situ plasma cleaning\n1-Ui NA NA NA NA NA NA NA 0.20 NA NA NA NA\nBCF4 NA NA NA NA NA NA NA 0.037 NA NA NA NA\nBC2 F6 NA NA NA NA NA NA NA NA NA NA NA NA\nBC3 F8 NA NA NA NA NA NA NA NA NA NA NA NA\nRemote plasma cleaning\n1-Ui NA NA NA NA NA 0.063 NA 0.018 NA NA NA NA\nBCF4 NA NA NA NA NA NA NA 0.037 NA NA NA NA\nBC2 F6 NA NA NA NA NA NA NA NA NA NA NA NA\nBC3 F8 NA NA NA NA NA NA NA NA NA NA NA NA\nBCHF3 NA NA NA NA NA NA NA 0.000059 NA NA NA NA\nBCH2 F2 NA NA NA NA NA NA NA 0.00088 NA NA NA NA\nBCH3 F NA NA NA NA NA NA NA 0.0028 NA NA NA NA\nBF2 NA NA NA NA NA NA NA 0.5 NA NA NA NA\nIn situ thermal cleaning\n1-Ui NA NA NA NA NA NA NA 0.28 NA NA NA NA\nBCF4 NA NA NA NA NA NA NA 0.010 NA NA NA NA\nBC2 F6 NA NA NA NA NA NA NA NA NA NA NA NA\nBC3 F8 NA NA NA NA NA NA NA NA NA NA NA NA\nNotes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.","path":["Title 40—Protection of Environment","CHAPTER I—ENVIRONMENTAL PROTECTION AGENCY","SUBCHAPTER C—AIR PROGRAMS","PART 98—MANDATORY GREENHOUSE GAS REPORTING","Subpart I—Electronics Manufacturing"],"source_url":"https://www.ecfr.gov/api/versioner/v1/full/2026-08-25/title-40.xml","current_through":"2026-08-25","vintage":"","retrieved_at":"2026-08-27T02:26:04Z","sha256":"1e05c1bc1a1658a9720a6768309f67bdd617090e0760101c18facc08800b34c2","source_id":"us-cfr","stale":true,"prev":"us/40-cfr-table-i-3-to-subpart-i-of-part-98","next":"us/40-cfr-table-i-5-to-subpart-i-of-part-98"},"notice":"GroundRules: Original legal text. Not legal advice."}