{"data":{"id":"us/40-cfr-table-i-5-to-subpart-i-of-part-98","jurisdiction":"us","citation":"40 CFR Table I-5 to Subpart I of Part 98","heading":"Table I-5 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing","body":"Process type factors Process gas i\nCF4 C2 F6 CHF3 CH2 F2 C3 F8 c− C4 F8 NF3 Remote NF3 SF6 C4 F6a C5 F8a C4 F8 Oa\nEtch 1-Ui 0.7 1 0.4 1 0.4 1 0.06 NA 1 0.2 NA 0.2 0.2 0.1 0.2 NA\nEtch BCF4 NA 1 0.4 1 0.07 1 0.08 NA 0.2 NA NA NA 1 0.3 0.2 NA\nEtch BC2 F6 NA NA NA NA NA 0.2 NA NA NA 1 0.2 0.2 NA\nCVD Chamber Cleaning 1-Ui 0.9 0.6 NA NA 0.4 0.1 0.02 0.2 NA NA 0.1 0.1\nCVD Chamber Cleaning BCF4 NA 0.1 NA NA 0.1 0.1 2 0.02 2 0.1 NA NA 0.1 0.1\nCVD Chamber Cleaning BC3 F8 NA NA NA NA NA NA NA NA NA NA NA 0.4\nNotes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.\n1 Estimate includes multi-gas etch processes.\n2 Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.","path":["Title 40—Protection of Environment","CHAPTER I—ENVIRONMENTAL PROTECTION AGENCY","SUBCHAPTER C—AIR PROGRAMS","PART 98—MANDATORY GREENHOUSE GAS REPORTING","Subpart I—Electronics Manufacturing"],"source_url":"https://www.ecfr.gov/api/versioner/v1/full/2026-08-25/title-40.xml","current_through":"2026-08-25","vintage":"","retrieved_at":"2026-08-27T02:26:04Z","sha256":"fc875b9b0b5e0aca630b500313bbed673d436b0c3d4c816e32ce557a3eb67afe","source_id":"us-cfr","stale":true,"prev":"us/40-cfr-table-i-4-to-subpart-i-of-part-98","next":"us/40-cfr-table-i-6-to-subpart-i-of-part-98"},"notice":"GroundRules: Original legal text. Not legal advice."}