40 CFR Table I-18 to Subpart I of Part 98: Table I-18 to Subpart I of Part 98—Default Factors for Gamma (gi,p and gk,i,p) for Semiconductor Manufacturing and for MEMS and PV Manufacturing Under Certain Conditions * for Use With the Stack Testing Method

Table I-18 to Subpart I of Part 98—Default Factors for Gamma (gi,p and gk,i,p) for Semiconductor Manufacturing and for MEMS and PV Manufacturing Under Certain Conditions * for Use With the Stack Testing Method

Process type In-situ thermal or in-situ plasma cleaning Remote plasma cleaning

Gas CF4 C2 F6 c-C4 F8 NF3 SF6 C3 F8 CF4 NF3

If manufacturing wafer sizes ≤200 mm AND manufacturing 300 mm (or greater) wafer sizes

gi 13 9.3 4.7 14 11 NA NA 5.7

gCF4,i NA 23 6.7 63 8.7 NA NA 58

gC2F6,i NA NA NA NA 3.4 NA NA NA

gCHF3,i NA NA NA NA NA NA NA 0.24

gCH2F2,i NA NA NA NA NA NA NA 111

gCH3F,i NA NA NA NA NA NA NA 33

If manufacturing ≤200 mm OR manufacturing 300 mm (or greater) wafer sizes

gi (≤ 200 mm wafer size) 13 9.3 4.7 2.9 11 NA NA 1.4

gCF4,i (≤200 mm wafer size) NA 23 6.7 110 8.7 NA NA 36

gC2F6,i (≤200 mm wafer size) NA NA NA NA 3.4 NA NA NA

gi (300 mm wafer size) NA NA NA 26 NA NA NA 10

gCF4,i (300 mm wafer size) NA NA NA 17 NA NA NA 80

gC2F6,i (300 mm wafer size) NA NA NA NA NA NA NA NA

gCHF3,i (300 mm wafer size) NA NA NA NA NA NA NA 0.24

gCH2F2,i (300 mm wafer size) NA NA NA NA NA NA NA 111

gCH3F,i (300 mm wafer size) NA NA NA NA NA NA NA 33

* If you manufacture MEMS or PVs and use semiconductor tools and processes, you may use the corresponding g in this table. For all other tools and processes, a default g of 10 must be used.