40 CFR Table I-5 to Subpart I of Part 98: Table I-5 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing

Process type factors Process gas i

CF4 C2 F6 CHF3 CH2 F2 C3 F8 c− C4 F8 NF3 Remote NF3 SF6 C4 F6a C5 F8a C4 F8 Oa

Etch 1-Ui 0.7 1 0.4 1 0.4 1 0.06 NA 1 0.2 NA 0.2 0.2 0.1 0.2 NA

Etch BCF4 NA 1 0.4 1 0.07 1 0.08 NA 0.2 NA NA NA 1 0.3 0.2 NA

Etch BC2 F6 NA NA NA NA NA 0.2 NA NA NA 1 0.2 0.2 NA

CVD Chamber Cleaning 1-Ui 0.9 0.6 NA NA 0.4 0.1 0.02 0.2 NA NA 0.1 0.1

CVD Chamber Cleaning BCF4 NA 0.1 NA NA 0.1 0.1 2 0.02 2 0.1 NA NA 0.1 0.1

CVD Chamber Cleaning BC3 F8 NA NA NA NA NA NA NA NA NA NA NA 0.4

Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

1 Estimate includes multi-gas etch processes.

2 Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.